JPE Brand Event｜JPE Shines at SEMICON Taiwan 2025!

SEMICON Taiwan 2025, one of the world’s most influential semiconductor trade shows, was grandly held from September 10–12, 2025, at the Taipei Nangang Exhibition Center. This year’s event reached a historic scale, gathering more than 1,200 leading semiconductor and technology companies, occupying 4,100 booths, and attracting over 100,000 professional visitors. With its unique modular component design and interactive booth, JPE stood out among numerous exhibitors, showcasing its technical strength in the wave of AI and data centers.



Focusing on 13 Key Technology Topics to Capture the Future of Semiconductors
SEMICON Taiwan 2025 highlighted cutting-edge topics such as AI chips, advanced packaging, 3DIC, Chiplet, FOPLP, heterogeneous integration, silicon photonics, quantum computing, and HBM high-bandwidth memory, comprehensively presenting the latest applications of chip design and smart manufacturing in the AI era. At the same time, the exhibition addressed critical issues such as semiconductor supply chain security, green manufacturing, geopolitical challenges, and talent development, underscoring Taiwan’s central role in the global semiconductor value chain. For JPE, this was a prime platform to showcase innovative technologies and solutions, as well as to engage and collaborate with industry leaders worldwide.

Modular Innovation, Reinventing Industry Advantages
This year, JPE showcased three major highlight products at SEMICON 2025:

1. UQD Universal Quick Disconnect
Specifically designed for liquid cooling systems in high-performance computers (HPC), data centers, and network switches, fully compliant with Intel and the OCP Open Compute Project standards. The dual-valve sealing design allows both ends to automatically and independently seal during connection and disconnection, effectively reducing coolant leakage risks; the flat-face interface prevents drips and air intrusion. Its tool-free, zero-leakage design simplifies liquid cooling maintenance, providing reliable and efficient thermal management solutions for cloud servers and AI data centers.



2. TNBV Series Trunnion Ball Valves
Developed for fluid control under high-pressure and high-temperature conditions, made of SS316L stainless steel with excellent corrosion resistance and strength, suitable for chemical media and industrial gases. The trunnion-supported structure reduces operating torque and minimizes seat wear, paired with FKM, PTFE, and PEEK seals to ensure long-term zero leakage. Each valve is tested with nitrogen at 500 psig, with high-pressure resistance up to 6000 psig. Equipped with anti-blowout stems and modular assembly design, they allow easy maintenance and reduce downtime costs.

3. JPE’s Modular Design
Each component is independently functional yet freely combinable, meeting diverse needs and greatly expanding product applications. Compact size, easy installation, and simplified SOP and maintenance processes enable outstanding competitiveness in semiconductors, data centers, and AI fields.



Smart Booth Design and Interactive Experiences Ignite Buzz
To give visitors an in-depth experience of JPE’s products and technologies, JPE created an interactive booth that combined vivid visual displays with professional explanations, simplifying complex technical concepts into accessible presentations. An on-site hands-on activity allowed guests to personally assemble quick disconnects, experiencing the precision of industrial design; a capsule toy machine was also set up, adding fun and interactivity, ensuring visitors left both entertained and impressed.



Looking Ahead, Co-Creating the New AI Era
The successful conclusion of SEMICON Taiwan 2025 once again demonstrated the vigorous growth of the semiconductor industry. JPE will take this exhibition as a new starting point to continue deepening its presence in the semiconductor and data center sectors, preparing for the arrival of the AI era with innovative technologies, and working hand in hand with global partners to embrace a smarter, more efficient, and more reliable future.